Language:en
  • zh-cn
  • en
  • ja
  • ru
  • fr

QCHIP

Product Details
  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0741-05-B2C-1-A
  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0741-05-B2C-1-A
Model TE0741-05-B2C-1-A
Product Category Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Trenz Electronic
Description MODULE FPGA KIN
Encapsulation -
Package Bulk
RoHS Status
Obtain quotation information
image of Microcontrollers, Microprocessor, FPGA Modules>21724386
21724386
Model
21724386
Product Category
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Trenz Electronic
Description
MODULE FPGA KIN
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
Product parameters
TYPEDESCRIPTION
MfrTrenz Electronic
SeriesKintex™-7
PackageBulk
Product StatusACTIVE
Connector TypeBoard-to-Board (BTB) Socket
Size / Dimension1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature0°C ~ 70°C
Module/Board TypeFPGA
Core ProcessorXilinx Kintex-7 FPGA XC7K160T-2FBG676C
Flash Size32MB
captcha

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
0755-83225727

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
点击这里给我发消息
0