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Product Details
  • image of Configuration PROMs for FPGAs>XC1736EPDG8C
  • image of Configuration PROMs for FPGAs>XC1736EPDG8C
Model XC1736EPDG8C
Product Category Configuration PROMs for FPGAs
Manufacturer Xilinx (AMD)
Description IC PROM SERIAL
Encapsulation -
Package Tube
Quantity 1000
RoHS Status
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image of Configuration PROMs for FPGAs>1280565
1280565
Model
1280565
Product Category
Configuration PROMs for FPGAs
Manufacturer
Xilinx (AMD)
Description
IC PROM SERIAL
Encapsulation
-
Package
Tube
Quantity
500
lang_roHSStatusStatus
Product parameters
PDF(1)
PDF(2)
TYPEDESCRIPTION
MfrXilinx (AMD)
Series-
PackageTube
Product StatusOBSOLETE
Package / Case8-DIP (0.300", 7.62mm)
Mounting TypeThrough Hole
Memory Size36kb
Programmable TypeOTP
Operating Temperature0°C ~ 70°C
Voltage - Supply4.75V ~ 5.25V
Supplier Device Package8-PDIP
DigiKey ProgrammableNot Verified
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