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  • image of Configuration PROMs for FPGAs>XC17S200AVOG8I
  • image of Configuration PROMs for FPGAs>XC17S200AVOG8I
Model XC17S200AVOG8I
Product Category Configuration PROMs for FPGAs
Manufacturer Xilinx (AMD)
Description IC PROM SERIAL
Encapsulation -
Package Tray
Quantity 1000
RoHS Status
Obtain quotation information
image of Configuration PROMs for FPGAs>1956686
1956686
Model
1956686
Product Category
Configuration PROMs for FPGAs
Manufacturer
Xilinx (AMD)
Description
IC PROM SERIAL
Encapsulation
-
Package
Tray
Quantity
500
lang_roHSStatusStatus
Product parameters
PDF(1)
PDF(2)
TYPEDESCRIPTION
MfrXilinx (AMD)
Series-
PackageTray
Product StatusOBSOLETE
Package / Case8-SOIC (0.154", 3.90mm Width)
Mounting TypeSurface Mount
Memory Size2Mb
Programmable TypeOTP
Operating Temperature-40°C ~ 85°C
Voltage - Supply3V ~ 3.6V
Supplier Device Package8-TSOP
DigiKey ProgrammableNot Verified
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